Presentation: Dynamic Thermal Circuit Reliability: Using ACE, Standardized Models, Module Database and ProcessBook

Dynamic Thermal Circuit Reliability (DTCR) calculates the maximum current carrying capability of power transmission lines (e.g. ampacity) to be calculated. The theory of DTCR relates to the cooling effect that temperature and wind can have on such lines. The resulting maximum may be greater than or less than the rated capacity of a particular transmission line, depending upon weather conditions.

In order to calculate ampacity, a power delivery path must be defined.  This path consists of power transformers and the transmission line segments that carry power between the transformers.  There are static thermal and rating information that needs to be maintained for each member of the path.  Additionally, the current amperage and weather conditions enter into the calculation (e.g. weather based heating or cooling).

SISCO will demonstrate and discuss what has been learned in the construction of a DTCR algorithm implemented in ACE.  Topics to be covered will be:

    Using the EPRI Common Information Model (CIM) to represent transmission paths and equipment characteristics.

     How the SISCO PI UDS Adapter facilitates population and maintenance of the PI Module Database in a manner that allows efficiencies for both PI ACE and PI ProcessBook.

     Using PI Tags and Module Mapping techniques for amperage and weather condition information.

     Design and scheduling choices when using ACE.

     How to use the Module Database to create self-adapting Process Book displays.